Phosphoric acid
- Molecular Formula: H3PO4
- CAS NO.: 7664-38-2
- EINECS No.: 231-633-2
- Execution standard: GB 1886.15-2015, GB/T 2091-2008, Q/320281NCJ 03, GB/T 28159-2011
- Package: 20L/200L HDPE drum, 1000L IBC tank, ISO tank or bulk.
- Storage: Packaged in plastic drums to prevent aging
1. Pharmaceutical and food grade phosphoric acid technical data:
| H3PO4 | SPECIFICATION |
| Color | Transparent colorless or light color |
| Condition | Sticky fluid |
| Content as H3PO4, w/% | ≥85.0/80.0/75.0 |
| Fluoride as F ppm | ≤10 |
| Reductive matter as H3PO3%,w/% | ≤0.012 |
| Arsenic as As: ppm | ≤0.5 |
| Heavy metal as Pb: ppm | ≤5.0 |
Application: used as an acidifier, chelating agent, yeast nutrient, pH regulator for brewing, and also in the production of food grade phosphates. Pharmaceutical additives (solvents), dental adhesives, and can also be used as analytical reagents.
2. Industry grade phosphoric acid technical data:
| H3PO4 | SPECIFICATION | ||
| I | II | III | |
| Appearance | Transparent colorless sticky fluid | ||
| Color | ≤20 | ≤30 | ≤40 |
| Content as H3PO4% | 85.0/ 80.0/ 75.0 | ||
| Chloride as Cl% | ≤0.0005 | ≤0.0005 | ≤0.0005 |
| Sulphate as SO4% | ≤0.003 | ≤0.005 | ≤0.01 |
| Heavy metal as Pb% | ≤0.001 | ≤0.001 | ≤0.005 |
| Arsenic as As% | ≤0.0001 | ≤0.005 | ≤0.01 |
| Iron as Fe% | ≤0.002 | ≤0.002 | ≤0.005 |
Application: used in electroplating,phosphating liquid and industrial phosphate production
3. LCD grade phosphoric acid technical data:
| H3PO4 | SPECIFICATION |
| Colority/Hazen | ≤ 5 |
| Content as H3PO4,w/% | ≥ 85 |
| Specific gravity（20℃/20℃） | 1.691～1.710 |
| Water-insoluble matters/ppm | ≤ 50 |
| Volatile acid as CH3COOH/ppm | ≤ 10 |
| Reductive matter as H3PO3/ ppm | ≤ 80 |
| Heavy metals as Pb / ppm | ≤ 4 |
| Fluoride as F / ppm | ≤ 10 |
| Nitric as NO3 / ppm | ≤ 5 |
| Sulfates as SO4 / ppm | ≤ 10 |
| Chloride as Cl / ppm | ≤ 1 |
| Arsenic（As）/ppb | ≤ 500 |
| Iron（Fe）/ppb | ≤ 500 |
| Sodium (Na) /ppb | ≤ 500 |
| Calcium (Ca) /ppb | ≤ 500 |
| Lead (Pb) /ppb | ≤ 500 |
| Manganese (Mn) /ppb | ≤ 500 |
| Nickel (Ni) /ppb | ≤ 500 |
| Copper (Cu) /ppb | ≤ 500 |
| Chromium（Cr）/ppb | ≤ 500 |
| Aluminum（Al）/ppb | ≤ 500 |
| Bismuth（Bi）/ppb | ≤ 500 |
| Cobalt (Co) /ppb | ≤ 500 |
| Potassium (K) /ppb | ≤ 500 |
| Lithium (Li) /ppb | ≤ 500 |
| Magnesium (Mg) /ppb | ≤ 500 |
| Strontium (Sr) /ppb | ≤ 500 |
| Zinc（Zn）/ppb | ≤ 500 |
| Antimony（Sb）/ppb | ≤ 3000 |
Application: used in LCD screen surface glass treatment and cleaning agent
4. IC grade phosphoric acid technical data:
| H3PO4 | SPECIFICATION | ||
| E1 | E2 | E3/E4 | |
| Appearance | Clear,colourless, viscous liquid | ||
| H3PO4 85%（%） | 85～87 | 85～87 | 85～87 |
| H3PO3 % | ≤0.005 | ≤0.001 | ≤0.001 |
| NO3- ppm | ≤5 | ≤0.5 | ≤0.5 |
| SO42-ppm | ≤10 | ≤5 | ≤5 |
| Cl- ppm | ≤1 | ≤0.5 | ≤0.2 |
| Al ppb | ≤200 | ≤50 | — |
| B ppb | ≤50 | — | |
| Sb ppb | ≤3000 | ≤300 | — |
| As ppb | ≤100 | ≤20 | — |
| Ba ppb | ≤100 | ≤20 | — |
| Cd ppb | ≤100 | ≤20 | — |
| Ca ppb | ≤1000 | ≤50 | — |
| Cr ppb | ≤100 | ≤20 | — |
| Co ppb | 100 | 20 | — |
| Cu ppb | ≤50 | ≤20 | — |
| Ga ppb | ≤100 | ≤10 | — |
| Au ppb | ≤100 | ≤10 | — |
| Fe ppb | ≤300 | ≤50 | — |
| Pb ppb | ≤100 | ≤20 | — |
| Li ppb | ≤100 | ≤10 | — |
| Mg ppb | ≤100 | ≤20 | — |
| Mn ppb | ≤100 | ≤20 | — |
| Ni ppb | ≤100 | ≤20 | — |
| K ppb | ≤100 | ≤20 | — |
| Ag ppb | ≤100 | ≤20 | — |
| Na ppb ≤ | ≤500 | ≤50 | — |
| Sn ppb ≤ | ≤— | ≤10 | — |
| Sr ppb ≤ | ≤100 | ≤20 | — |
| Ti ppb ≤ | ≤100 | ≤50 | — |
| Zn ppb ≤ | ≤100 | ≤50 | — |
| particle（μm，pcs/mL） | As per customer’s request | ||
Application:
used as cleaning agent and etching agent for semiconductor separation devices
used in large-scale integrated circuits:
- Cleaning before gluing the substrate
- Etching and final degumming inphotolithography
- Cleaning inthe silicon wafer process and insulating film etching, semiconductor film etching, conductor film etching, organic material etching,etc.